air-cooled-heat-sinks

Passive Heat Sinks

Thermal management and design is critically important to the reliability and function of electronic components. Air cooled heat sinks are the simplest and often most efficient method to cool devices. Conducting heat away from the components through direct contact, they rely on a large surface area to move the heat into the surrounding air.

Traditionally micro-channels, fins and pins are used to increase the surface area to enable more effective movement of heat but with VersarienCu’s patented process we are able to increase the surface area significantly with the microporous nature of our copper foam improving performance and decreasing the likelihood of component failure.

PASSIVE/NATURAL CONVECTION

Passive cooling does not require fans or directional convection. Normally suitable for lower power components in a passive environment; natural convection heat sinks rely on a large surface area to remove the heat from the component and into the ambient air. Normally made from aluminium extrusions or copper and aluminium sheets stamped into shape they form a critical weapon in the battle against heat.

VersarienCu is the ideal material for passive cooling. Its huge surface area and the low thermal resistance of copper enable VersarienCu passive heat sinks to cool components better than any competing product. High performance, cost effective and ultra low profile they provide the perfect solution for cooling board level components even in the tightest of spaces.

Check out our range of passive heat sinks.

FORCED CONVECTION

Often passive cooling is not enough to ensure the temperature of components stay within operating limits. With the ever increasing number of components and an overall increase in power within electronic devices, forced convection is often the best method to keep a large number of components cool within a package. From PC’s to servers to high power electronics, in fact anywhere you hear the buzzing of fan, forced convection is being used to cool electronic devices.

Similar to passive cooling, surface area is critical to maximising the effect of air movement and convection. Increasing density of fins and pins and optimising designs for directional air flow significantly improve performance. The VersarienCu foam structure is unique in its ability to increase surface area which allows simpler designs with lower profiles yet providing increased thermal performance.

To find out more about our forced convection work please contact our information team.

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